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Solutions by Industry Automotive Communications Consumer Data Processing Industrial K&S Launches Power™-C the Dedicated Wedge Bonder for Single-Row TO Package Power™-C Wedge Bonder is built specifically for single-row TO package power devices. These bonders are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems and wire feeding mechanisms, that are on the PowerFusion™ and Asterion™ platforms. Learn More K&S Launches ULTRALUX™ Automatic Wire Bonder ULTRALUX™ is the latest generation ball bonder utilizing the latest technologies and materials that will save LED manufacturers up to 10% capital cost. Learn More K&S Launches ASTERION™ UW the Latest Ultrasonic Interconnect Technology Solutions The Asterion™ UW ultrasonic welder is engineered with the latest architecture that includes a torsional ultrasonic system mounted on a highly reliable and fast direct-drive XYZ motion system. Learn More K&S Celebrates 68 Years of Technological Discoveries It has been an amazing journey from where we were almost seven decades ago – our founders Frederick W. Kulicke Jr. and Albert Soffa – were just designing and building many different types of equipment before deciding to take the entrepreneurial leap of faith. It wasn’t long before we began creating lasting value within the semiconductor packaging space. Share it on LinkedIn News Discover recent K&S news and stories. View All News Kulicke & Soffa to Participate at SEMICON China 2020 SINGAPORE--(BUSINESS WIRE)--Jun. 25, 2020-- Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) (“Kulicke & Soffa”, “K&S” or “Company”), announced today that it will be exhibiting at the SEMICON China 2020 trade show in Shanghai, China, from June 27 to 29. The new ULTRALUX™ automatic wire bonder along with the POWER-C™ wedge bonder will debut at the trade show. The ULTRALUX™ wire bonder utilizes the latest technologies and material which offers cost-of-ownership advantage, delivering high productivity and yield. Its quick LED suite ensures time to market optimization with quick bond, stitch and loop processes. K&S’s new POWER-C™ wedge bonder is built specifically for single-row TO package power devices. The bonder is engineered with a proven and powerful direct-drive motion system, bondhead, ultrasonic generator system and wire feeding mechanism. Its expanded pattern recognition capabilities deliver industry leading productivity and reliability. Other K&S solutions such as the RAPID™ Pro GEN-S series ball bonder, capillaries and dicing blades will also be showcased. Nelson Wong, Kulicke & Soffa’s Senior Vice President of Global Sales, said, “Over the past several months, we continued our commitment to ongoing product development and our long-term technology roadmap. This approach allows us to continue delivering innovative and high-performance solutions directly supporting the rapid pace of technological advancements in areas such as smart manufacturing, 5G, IoT, electric vehicles and next-generation displays.” Customers can see the full assembly of solutions at the SEMICON China trade show in Shanghai, China, Hall E3, Booth #3417 or visit K&S’s virtual exhibition booth. About Kulicke & Soffa Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets. Founded in 1951, K&S prides itself on establishing foundations for technological advancement - creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor reductions and assembly excellence of current and next-generation semiconductor devices. Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future ( www.kns.com ). Kulicke & Soffa Industries, Inc. Marilyn Sim Public Relations P: +65-6880-9309 F: +65-6880-9580 msim@kns.com Kulicke & Soffa Industries, Inc. Joseph Elgindy Investor Relations & Strategic Initiatives P: +1-215-784-7500 F: +1-215-784-6180 investor@kns.com Jun 25, 2020 Kulicke & Soffa Appoints Jeff Richardson to its Board of Directors SINGAPORE--(BUSINESS WIRE)--May 29, 2020-- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company") today announced the appointment of David Jeffrey Richardson to its Board of Directors. Mr. Richardson brings over 32 years of semiconductor industry experience to the K&S board and currently serves as Chairman of Lattice Semiconductor Corporation (NASDAQ: LSCC) and a Director of Ambarella (NASDAQ: AMBA). Mr. Richardson was Executive Vice President, and ultimately Chief Operating Officer, of LSI Corporation from 2005 through its 2014 acquisition by Avago, now Broadcom Inc. (NASDAQ: AVGO). Prior to the role of Chief Operating Officer, he held responsibilities within Corporate Planning and Strategy and later served as General Manager of several product groups. Previously, from 1997 through 2005, Mr. Richardson held increasing roles of responsibility at Intel Corporation (NASDAQ: INTC) eventually serving as Vice President and General Manager of the Server Platforms Group. Garrett Pierce, Chairman of the K&S Board of Directors, stated “Jeff’s management track record and deep-rooted technical background will be invaluable as K&S diversifies and grows to the next level. We look forward to working with him to further enhance stakeholders’ value.” “...